| Item | Standard | High | Advanced | |
| Min. LW & Space | I/L | 3.5 mil / 3.5 mil | 3 mil / 3 mil | 2.5 mil/ 2.5 mil |
| O/L | 4.5 mil /4.5 mil | 4 mil / 4 mil | 3.5 mil / 3.5 mil | |
| Smallest Drill Size | 10 mil | 8 mil | 6 mil | |
| Smallest Laser Drill Size | 6 mil | 4 mil | 4 mil | |
| Impedance Tol. | ±10% | ±8% | ±5% | |
| Layer Count | up to 34 | 44+ | 50+ | |
| Finished Board thick. ( mil) | 14-250 | 14-260 | 10-270 | |
| Panel Size ( inch) | 16x18, 18 x 24, 21x24, 21x28, 24x30 | |||
| Pad Size ( mil) | Drill+12 | Drill+10 | +6 | |
| Min. Dielectric Thick. (mil) | 2 | 1 | 1 | |
| Surface Finish | OSP, HASL, ENIG, Electrolytic Au., Immersion Ag., Tin | |||
| Aspect Ratio | 12:1 | 14:1+ | 20:1 | |
| Blind & Buried Via | Yes | Yes | Yes | |
| Micro Via & Build-Up Tech. | Yes | Yes | Yes | |
| Material Types | Tg=140 ºC, 170 ºC, 190 ºC, Epoxy, BT, Teflon, Low Dk., Df. | |||
Copyright 2007 © ISUPETASYS CORP.
All rights Reserved
All rights Reserved